AMSM 2024, Incheon, Korea
October 27 - October 30, 2024 (Sun. - Wen.), Songdo ConvensiA
Abstract
Organic photodiodes are ideal for advanced flexible electronic applications such as imaging and video photography due to their tunable photophysical properties, low-cost and simple processing methods, and continuously improving performance. In particular, the simple design and thin thickness of organic material-based devices enable the control of optical and geometrical crosstalk, garnering attention for application in image sensors. Utilizing these organic photodiodes in image sensors necessitates their integration into high-density arrays. This approach is essential for achieving the precise and effective performance required for advanced imaging applications. However, the absence of precise pixelation techniques capable of implementing organic light-emitting semiconductor with high production and reliability has limited the realization of high-density organic photodiodes. In this paper, we present a silicone engineered anisotropic lithography of the organic light-emitting semiconductor (OLES) that in-situ forms a non-volatile etch blocking layer during reactive ion etching. This unique feature not only slows the etch rate but also enhances the anisotropy of etch direction, leading to gain delicate control in forming ultrahigh-density multicolor OLES patterns (minimum line width of 2µm) through photolithography. This patterning strategy inspired by silicon etching chemistry is expected to provide new insights into high-density organic photodiodes. Furthermore, the proposed system is expected to be applicable to flexible substrates, extending its use to soft sensor applications such as artificial eyes.