KIEEME 2021, Pyeongchang, Korea
June 30 - July 2, 2021 (Wed. - Fri.), Alpensia
Design of Orthogonal Polymer Semiconductor Gels for High Physical and Chemical Resistance
Ryungyu Lee, Keun-Yeong Choi, Han Wool Park, and Do Hwan Kim, Hojin Lee
Abstract
Presently commercialized organic light-emitting diode (OLED) displays have limitations in implementing future high-resolution displays as fine metal mask (FMM) methods are commonly utilized to implement pixel patterns. To this end, lots of research have been done through printing methodology including inkjet printing, screen printing, and organic vapor jet printing to implement high-resolution OLED pixel array. However, the printing process suffers from critical problems associated with cross contamination, pattern uniformity, and deterioration of unique physical/photoelectric characteristics during the sequential process of pixel formation. In this regard, light-emitting organic semiconductor as a core material of OLED requires physical and chemical resistance to improve durability. In this work, we propose an OLED with differentiated technologies by implementing orthogonal polymer semiconductor gel (OPSG) conversion technology that is durable against external stimuli and maintain intrinsic photoelectric propose.
